24 hours turn time on double sides PCB's,2-4 days for multilayer PCB's.
Producing over 19,000 unique part numbers per month .
Current products manufactured include backplanes, hybrid boards, HDI boards, High TG boards, High Frequency boards, Halogen Free boards, Flex and Rigid Flex boards, Metal Substrate boards, IC Substrate boards and more.
Fastprint has purchased advanced PCB manufacturing equipments, inspection equipments and software from the United States, Japan, Israel, Germany, Italy and Taiwan.
Layers count: 50
Min Line width/spacing(mil): 3.0/3.0
Max Aspect Ratio: 40:1
Board thickness(mil): 0.2mm~8.0mm
Max Panel size: 22.5″* 49″
Material: FR-4,High Tg FR-4,Halogen free,High Frequency
Surface Treatment: HASL,ENIG,ENEPIG,Immersion Silver,Immersion Tin,Flash Gold,Golden Finger,OSP,Lead free HASL etc.
Mass production capacity for high density rigid-flex board fabrication
Layer Count/flex layer:36/10
Min Line width/spacing for inner layer(mil): 3.0/3.0
Max Aspect Ratio: 20:1
Min Hole size(mil): 6
3+C+3: Mass production
4+C+4：Small volume﹠Mass production
Laser via（Plugging via）：Mass production
Min microvia hole size(mil) ：4
Metal substrate board
Layers count：Metal substrate: 1-12L
Embedded metal/Heat sink/Sweat bonding: 2-24L
Ceramic substrate: 1-2L
Board thickness ：0.5-7.0mm
Size：max:610*610 mm ,min:5*5mm
Mechanic: X/Y/Z tolerance±0.03mm, speaker hole, screw hole
Thermal conductivity: Standard materials: 1-4W/m.k,
Specified materials : 5-12W/m.k
Ceramic materials: 24-170W/m.k
Max copper thickness：28OZ
Metal partial surface treatment: Anodic oxidation, Hard anodic oxidation coating, Chemical passivation, Sandblasting, Wire drawing, Al electroplating
Surface treatment: Leaded HASL/Lead free HASL, OSP, ENIG, ENEPIG, Plating(Ni)Soft/Hard gold, Immersion Sn, immersion silver, Organic Coating
Type: Pre-bonding, Postbonding, Sweat bonding, Metal substrate, Embedded metal, Heatsink,